Research in Biocompatible Electroless Gold Plating
نویسندگان
چکیده
منابع مشابه
Electroless Nickel Plating with Hypophosphite
In the previous chapter, the components of electroless nickel plating baths were discussed from the viewpoint of the function each performs in the bath, with little attention paid to their effect on the plating process. The metal and the electron source (the reducing agent) are consumed in the electroless plating reaction and so their concentrations in the bath are continuously decreasing. Ther...
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In this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) – thickness of the plating film and phosphorous content – are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nic...
متن کاملElectroless Nickel Plating on Magnesium Alloy
he inherent lightness and good strength-to-weight ratio of T magnesium has focused attention on increasing applications in aerospace and allied fields. Its density is two thirds that of aluminum-a conventional structure material for aerospace. Magnesium has one drawback: It is prone to atmospheric corrosion. Further, because of its high chemical affinity for aqueous solutions, it is categorized...
متن کاملData-Based Modeling of Electroless Nickel Plating
This work connects the neocybernetic theory of elastic systems to modeling of a complex industrial process. It turns out that using simple mathematics combined with multilinear tools leads to linear models that can be used for monitoring and control. As an application example, electroless nickel plating is studied.
متن کاملThe Root Cause of Black Pad Failure of Solder Joints with Electroless Ni/Immersion Gold Plating
This paper reports on a study of the reaction of solder with the electrolessnickel with immersion gold (ENIG) plating system, and the resulting interfacial structures. A focused-ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the ENIGplated pad with and without soldering. High-speed pull testing of solder joints was performed to expose the pad sur...
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ژورنال
عنوان ژورنال: Journal of The Surface Finishing Society of Japan
سال: 2019
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.70.461